Ultra Microtome
Leica EM UC7
Device Description
Used for ultra-thin sectioning for TEM, surface planning for SEM and AFM examinations, semi-thin section preparation for light microscopy and FTIR.
- The device has a 90 °C rotatable microscope carrier.
- Slices from 1 nm to 15 microns are possible.
- The cutting speed of the device can be adjusted between 0.05 and 100mm/second.
- Knife holder can move left-right (E-W) 25 mm motorized.
- The blade holder can move forward and backward at least 10 mm motorized.
- It is possible to prepare nano and micro-thick ultra-thin sections with the ultra-microtome
